Search for: [Abstract = "In this paper the problem of cooling a component, in the interior of which heat is generated due to its work, was solved analytically. the problem of cooling of a processor with the use of a heat pump was solved based on a earlier theoretical analysis of authors of external surface cooling of the cooled component by using the phenomenon of liquid evaporation. Cases of stationary and non\-stationary cooling were solved as well."]

Number of results: 1