Search for: [Abstract = "In the present study, the residual stress build\-up in an electron beam physical vapour deposition \(EB\-PVD\) based TBCs on a coupon during thermal cycling has been studied by varying three parameters such as the cooling rate, TBC thickness and substrate thickness. A two\-dimensional thermo\-mechanical generalized plane strain finite element simulations have been performed for thousand cycles. It was observed that these variations change the stress profile significantly and the stress severity factor increases non\-linearly. Overall, the predictions of the model agree with reported experimental results and help in predicting the failure mechanisms."]

Number of results: 1